Technical Product Bulletin
1.5 Grams Arctic Silver Comparable Thermal Compound Paste - Super Conductive USA PR
It is grease like silicone material, heavily filled with efficient heat conductive zinc oxide and a binding agent, this combination promotes
high thermal conductivity, high temperature stability, and the lowest amount of bleed and evaporation. This thermal compound resists
changes in consistency temperatures up to 180°C; function as heat transfer media, durable dielectric insulation, barrier against
environmental contaminants and as a stress-relieving shock and vibration absorber over a wide temperature and humidity range.This
thermal paste is resistant to ozone and ultraviolet degradation and has good chemical and solvent stability, good interference between the
heat producing device and the heat transfer media, and low surface tension that enables them to wet most surfaces. It will not harden, dry,
or melt after 1200 hours @ 205°C. Used by Ford Motors for over 10 years.
ELECTRICAL PROPERTIES:
Dielectric Strength, volts/mil (ASTM D 150) | 390 |
Dielectric Constant @ 100Hz (ASTM D150) | 4.40 |
Dissipation Factor @ 100Hz (ASTM D150) | 0.0021 |
Volume Resistivity, ohm-cm (ASTM D257) | 2.9x1014 |
THERMAL PROPERTIES:
Thermal Conductivity W/m-K | 0.88 |
Operating Temperature Range, °C | -60 to 205 |
Thermal Resistance °C-In2 /W | 0.05 |
TYPICAL PROPERTIES AND CHEMICAL CHARACTERISTICS:
Color | White |
Base Fluid | Dimethyl Polysiloxane |
Filler | Zinc oxide |
Specific Gravity, 25°C, gm/cc | 2.45 |
Viscosity | Paste |
Press Flow @ 42.5 PSI, 25°C sec | 13 |
Penetration (Worked), mm | 2851/10 |
Evaporation 24 hrs @25°C, % | 0.0 |
Evaporation @ 200°C 24H by weight,% | 0.5 |
Bleed 24 Hours, % | 0.6 |
POTENTIAL USES:
· Effective thermal coupler for any heat sink device, CPU to heat sink
· Automotive temperature-sensing devices
· Temperature sensors
· Applied to the base and mounting studs of transistor, diodes and silicone controlled rectifiers· Power transistors
· Diodes, semiconductors
· Thermal Joints
· For any device where efficient cooling is required
· Potting
· TEC Modules
· Hardware
· Telecommunications
· Right product for thermal management
· High-voltage corona suppressant in connectors for fly back transferors located in TV sets.
· Non-Sag or flowing
· Non-Hazardous polymerization
· Non-Toxic
· Non-Corrosive
· Reworkable
· Easily removed
· Non-Flammable
· Easy to apply via dispensing or screen printing
· Low surface tension that enables it to wet most surfaces, which can lower the thermal contact resistance between the substrate
and material.
APPLICATION METHODS:
Automated or manual dispensing
USAGE INSTRUCTIONS:
For industrial use only Read MSDS carefully prior to use.
LIMITATIONS:
This compound is neither tested nor represented as suitable for medical or pharmaceutical use.
STORAGE HANDLING & SHELF LIFE:
This product has a shelf life of 5 years at room temperature (76°F) in an unopened container, settlings may occur during long term storage, it is
recommended to re-mix the filler by hand or mechanical mixing. Keep container tightly closed store in cool area away from ignition sources and oxidizers,
no special precautions need to be taken if product is handled according