Transistor, Diodes & Silicone Thermal Grease Compound, AA-Grease 04, 50gm

$49.99
Type
Thermal Compound
Packaging
Syringe
Brand
Atom Adhesives
MPN
AA-GREASE 04
Country/Region of Manufacture
United States
Typical Applications 1
Effective thermal coupler for any heat sink device
Typical Applications 2
CPU to heat sink Temperature sensors.Potting
Typical application 3
Automotive temperature-sensing devices.
Typical applications 4
base and mounting studs of transistor, diodes
Typical Applications 5
silicone controlled rectifiers Power transistors
Typical Applications 6
semiconductors Thermal Joints TEC Modules
Typical Applications 7
Hardware Telecommunications Right product Thermal
Typical Applications 8
High-voltage corona suppressant Transferors
condition
New

Technical Product Bulletin

1.5 Grams Arctic Silver Comparable Thermal Compound Paste - Super Conductive USA PR



PRODUCT DESCRIPTION:

Heat sink thermally conductive grease compound, used successfully by Ford Motor Company for 20 years, direct replacement for Dow 

340 and  Wakefield 120,complies to MIL-DTL-4-7113, less than 30µ particle size, low bleeding, low VOC. This product is an opaque 

white heat sink grease compound, which is applied to the base and mounting studs of transistor and diodes to provide a positive heat 

sink seal, this facilitates heat transfer away from electrical/electronic components and into heat sinks, thereby increasing the overall 

efficiency and performance of the device.

 It is grease like silicone material, heavily filled with efficient heat conductive zinc oxide and a binding agent, this combination promotes

 high thermal conductivity, high temperature stability, and the lowest amount of bleed and evaporation. This thermal compound resists 

changes in consistency temperatures up to 180°C; function as heat transfer media, durable dielectric insulation, barrier against 

environmental contaminants and as a stress-relieving shock and vibration absorber over a wide temperature and humidity range.This

thermal paste is resistant to ozone and ultraviolet degradation and has good chemical and solvent stability, good interference between the 

heat producing device and the heat transfer media, and low surface tension that enables them to wet most surfaces. It will not harden, dry,

 or melt after 1200 hours @ 205°C.  Used by Ford Motors for over 10 years.


ELECTRICAL PROPERTIES:

Dielectric Strength, volts/mil (ASTM D 150)390
Dielectric Constant @ 100Hz (ASTM D150)4.40
Dissipation Factor @ 100Hz (ASTM D150)0.0021
Volume Resistivity, ohm-cm (ASTM D257)2.9x1014


THERMAL PROPERTIES:

Thermal Conductivity W/m-K0.88
Operating Temperature Range, °C-60 to 205
Thermal Resistance °C-In2 /W0.05


TYPICAL PROPERTIES AND CHEMICAL CHARACTERISTICS:

ColorWhite
Base FluidDimethyl Polysiloxane
FillerZinc oxide
Specific Gravity, 25°C, gm/cc2.45
ViscosityPaste
Press Flow @ 42.5 PSI, 25°C sec13
Penetration (Worked), mm2851/10
Evaporation 24 hrs @25°C, %0.0
Evaporation @ 200°C 24H by weight,%0.5
Bleed 24 Hours, %0.6


POTENTIAL USES:

·      Effective thermal coupler for any heat sink device, CPU to heat sink

·      Automotive temperature-sensing devices

·      Temperature sensors

·      Applied to the base and mounting studs of transistor, diodes and silicone controlled rectifiers

·      Power transistors

·      Diodes, semiconductors

·      Thermal Joints

·      For any device where efficient cooling is required

·      Potting

·      TEC Modules

·      Hardware

·      Telecommunications

·      Righproduct for thermal management

·      High-voltage corona suppressant in connectorfor fly back transferors located in TV sets. 

·      Non-Sag or flowing

·      Non-Hazardous polymerization

·      Non-Toxic

·      Non-Corrosive

·      Reworkable

·      Easily removed

·      Non-Flammable

·      Easy to apply via dispensing or screen printing

·      Low surfactension that enables it to wet most surfaces, which can lower the thermal contact resistancbetween the substrate

 and material.


APPLICATION METHODS:

Automated or manual dispensing


USAGE INSTRUCTIONS:

For industrial use onlRead MSDS carefully prior to use.


LIMITATIONS:

This compound is neither tested nor represented as suitable for medical or pharmaceutical use. 


STORAGE HANDLING & SHELF LIFE:

This product has a shelf life of 5 years at room temperature (76°F) in an unopened container, settlings may occur during long term storage, it is

recommended to re-mix the filler by hand or mechanical mixing. Keep container tightly closed store in cool area away from ignition sources and oxidizers,

no special precautionneed to be taken if product is handled according