Properties
Color: white
Surface drying time: 2-8 min
Hardness (Shore A): 45-75
Tensile strength (MPa): 2.0
Elongation: 100%
Adhesion and tensile strength(MPa): 1.5-2.0
Thermal conductivity(W/m.k): > 0.975
Working temprature range: -76 to 392 F (-60 to 200C)
Non-Electrical Conductive
Volume resistance(c-in/W): < 2.0x10^15
Dielectric strength(KV/mm): 20
Dielectric constant: 3.0
Dielectric loss factor(60Hz): 0.003
Continuous use temp: 200℃
Content:
Silicone material: 30%
Thermal conductive material: 40%
Strengthen fillers: 20%
Crossing agent: 10%
Premium thermal glue for bonding and conducting heat at the interface of cooler heatsink and GPU VRM VRAM PCB LED, BJT MOSFET transistor, Voltage regulator, IC Chips, Thermoelectric Peltier Cooler Module
10 gram high performance thermal glue with strong adhesion.
Thermal conductivity > 0.975 w/mk
Thermal Impedance: < 0.06
Non-Electrical Conductive, Non-corrosive ,Non-toxic, High Performance, Working at High temprature for cooling electronics, robotics.
Premium thermal glue for bonding and conducting heat at the interface of cooler heatsink and GPU VRM VRAM PCB LED, BJT MOSFET transistor, Voltage regulator, IC Chips, Thermoelectric Peltier Cooler Module