ASM-TF universal no-clean tacky soldering flux for leaded or lead-free soldering used in automated assembly (ROL0) - automated soldering machines - pneumatic dispensers, solder paste printers, profiled reflow ovens.
Successfully competing with RMA in performance the ASM offers lower viscosity, light color body and clear residue benefiting from acrylic rosin of high purity and clarity.
No-clean residue, odorless formulation with QC-Aid™ glowing in UV for instant visual PCB QC certification.
Low Electrochemical Migration and Surface Insulation Resistance, excellent performance for repair/rework hand-soldering on most surface finishes using all popular soldering methods and technics.
Responsibly made in the USA in compliance to applicable standards.
Descriptive comparison: STIRRI® ASM-TF
STIRRI® ASM-TF no-clean soldering tacky flux (ROL0)
Soldering Tacky Paste Flux | STIRRI® ASM-TF | |
Classification J-STD-004C | ROL0 | |
Designation IPC-TM-650 2.3.35 | Universal | |
Cleaning process | Solvents | |
Tacky Flux | Speciality | Universal |
Compatibility with alloy systems | Sn/Pb & LF | |
Viscosity - Flux Malcom @ 10 RPM/25°C (x103mPa/s) IPC-TM-650: 2.4.34.4 | 40-52 | |
Matching Core Wire | NC (No-clean) | |
Solder Paste | Stencil Life @ 30-70% RH & 20-25°C | >12 hours |
Viscosity - Printing Malcom @ 10 RPM/25°C (x103mPa/s) IPC-TM-650: 2.4.34.4 | 210-300 Sn63/Pb37 T3/T4 | |
Viscosity - Dispensing Malcom @ 10 RPM/25°C (x103mPa/s) IPC-TM-650: 2.4.34.4 | 100-140 Sn63/Pb37 T3/T4 | |
Tack Value IPC-TM-650: 2.4.44 | 54g | |
Surface Insulation Resistance 85°C, 85% RH @ 168 Hours IPC-TM-650: 2.6.3.7 | L: ≥100 MΩ (no-clean) | |
IPC Test Results | Corrosion IPC-TM-650: 2.6.15 | L: No corrosion |
Quantitative Halides IPC-TM-650: 2.3.28.1 | L: <0.05% | |
Copper Mirror IPC-TM-650: 2.3.32 | L: No breakthrough | |
Electrochemical Migration IPC-TM-650: 2.6.14.1 | L: <1 decade drop (no-clean) | |
Alloys Compatibility | Sn42/Bi58 (Eutectic) | 138°C |
Sn42/Bi57.6/Ag0.4 | 140°C-139°C | |
Sn43/Pb43/Bi14 | 163°C-144°C | |
Sn62/Pb36/Ag2 (Eutectic) | 179°C | |
Sn62.8/Pb36.8/Ag0.4 | 183°C-179°C | |
Sn63/Pb37 (Eutectic) | 183°C | |
Sn60/Pb40 | 188°C-183°C | |
Sn96.5/Ag3.0/Cu0.5 | 219°C-217°C | |
Sn99/Ag0.3/Cu0.7 | 221°C-217°C | |
Sn96.5/Ag3.5 (Eutectic) | 221°C | |
Sn99.3/Cu0.7 (Eutectic) | 227°C | |
Sn95/Sb5 | 240°C-235°C | |
Sn95/Ag5 | 245°C-221°C | |
Sn10/Pb88/Ag2 | 290°C-268°C | |
Compliance | RoHS II Directive 2011/65/EU | RoHS II COMPLIANT |
EICC Conflict Minerals Compliance | EICC COMPLIANT | |
REACH Articles 33 and 67 of Regulation (EC) No 1907/2006 | RESTRICTED Contains substances >0.1% w/w that is listed as a SVHC or restricted for use in solder materials | |
MADE IN USA BY STIRRI® | STIRRI® ASM-TF |
Safety Notice
This product is designed for the professional audience. The information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having relevant skills at their own risk. Consumers should make their own tests to determine the suitability of each product for their particular process and take safety measures. Manufacturer/resellers assume no liability for results obtained or damages incurred through the application of the data presented.
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