Specification:
Model: bst-328
Size: 37 * 20MM
Composition: Sn63 / Pb37
Melting point: 183 °
Feature:
Used for the laptop/computer/mobile phone/home appliances SMD IC and BGA IC repairing ,tools for chip-level repairing.
Is a must product for mobile phones and precision equipment maintenance.
Weight: approx. 50g
White and plump solder joint.
No false welding, strong adhesive with solder iron tip.
Viscous force lasting, not easy to dry.