Silver Conductive Easy 1 to 1 Mix Ratio RMI EFI Shielding PCB Epoxy 50 gm, 907

Slide
$156.99
Brand
Atom Adhesives
Model
AA-DUCT 907-50
MPN
907
Country/Region of Manufacture
United States
Typical Applications 1
Electrical, conductive, rmi / efi shielding
Typical Applications 2
circuitry printed circuit board electronic repair
Substrates 1
aluminum, copper, magnesium, steel, bronze
Substrates 2
nickel, kovar, ceramic, glass
Substrates 3
phenolic and G-10 epoxy glass boards.
Benefits
High strength Perfect bond Cold solder
condition
New

Technical Product Bulletin

PURE SILVER FILLED ELECTRICALLY CONDUCTIVE EPOXY MAXIMUM CONTINUITY OF CONDUCTIVITY

PRODUCT DESCRIPTION:

This product is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm•cm.

It is also characterized by a wide operating temperature range from –50 to +170°C.

This product is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.

GENERAL PROPERTIES

APPEARANCE

Silver

CURE TYPE

Heat cure or Room temperature

BENEFITS

High strength
Perfect bond
Cold solder for heat sensitive components

MIX RATIO BY WEIGHT

100:7 / Resin:Hardener

SUBSTRATES

Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.

OPERATING TEMPERATURE

-50 to 170 °C

TYPICAL APPLICATIONS

Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair

UNCURED PROPERTIES

VISCOSITY @ 25 °C CPS

Paste

SPECIFIC GRAVITY, MIXED

2.79

REACTIVE SOLIDS CONTENTS, %

100

POT LIFE

30 minutes

CURE SCHEDULE:

2 MINUTES

@ 120°C

5 MINUTES

@ 100°C

12 HOURS

@ 25°C

MISC PROPERTIES:

HARDNESS, SHORE D

83

SHRINKAGE LINEAR IN/IN

0.003

LAP SHEAR STRENGTH, PSI

9400

VOLUME RESISTIVITY OHM CM

> 0.0001

GENERAL INFORMATION:

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

HOW TO USE:

1) Carefully clean and dry all surfaces to be bonded.

2) Apply this compound completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.

3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.

4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.

AVAILABILITY:

This epoxy can be supplied in various different packages