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Free USPS First Class Shipping. May receive as quickly as in 3 days! |
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Description on Solder Paste |
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- Solder Iron or element surface oxidation，not easy adhesion of tin and the next welding,
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with rosin can quickly remove oxidation，making components stick to the surface effortlessly |
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Specifications: |
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- No deterioration no dry |
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- No poison and No corrosion
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- Good immersion
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- Joint high intensity
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- Perfect for mobile phones, PC cards and other sophisticated electronic chip-level flux welding
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- Color: Yellow |
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- Capacity: 80g
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Description on Solder Wire |
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- 100% Brand New
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- Type : RMA-223 |
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- High strength joints
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- Excellent immersion and insulation |
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- Smooth welding / soldering surface
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- No deterioration, no dry
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- Neutral PH 7?0.3 |
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- No corrosion
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- Volume : 1 ×16gram |
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- Dimension : 27mm × 90mm
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- No Silver or Tin
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- HMIS rating: H=2, F=1, R=0, P.P.=B
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- Dispensing rod/needle NOT included
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- RMA-223 is a high viscosity no-clean flux
For PCB BGA SMD PGA PCA reworking. |
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- Soldering and reballing of computer and phone chips, and other circuit board uses
High-quality
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alloyed powder and resin paste flux |
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- NO pale yellow residue
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Solder Tip Tinner Description
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- 100% Brand New |
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- Brief content visible, double tap to read full content
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- Full content visible, double tap to read brief content
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Features and Specification
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- Thermaltronics TMT-TC-2 Tip Tinners is a compressed tablet of pure tin and ammonia phosphate
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formulation in a metal container with lid. It has a self adhesive pad on the underside to allow it to |
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be affixed on, or near the work station. Thermaltronics TMT-TC-2 Tip Tinners provides fast, |
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efficient cleaning and re-tinning of blackened and highly oxidized soldering iron tips, safely |
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and efficiently. |
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Included in this package
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- 1X 50 Gram Soldering Paste
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- 1X 20 Gram Solder Iron Tip Tinner
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- 3X 16 Gram Soldering Wire
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