Electrically Conductive Silver Epoxy Adhesive, Heat Cure Required 904, 2.5 gm

$19.99
Brand
Atom Adhesives
Model
AA-DUCT 904-2
MPN
904-2
Country/Region of Manufacture
United States
Benefit
High strength mechanical, electrical properties
Substrates 1
aluminum, copper, magnesium, steel, bronze
Substrates 2
nickel, kovar, ceramic, glass
Substrates 3
phenolic and G-10 epoxy glass boards
Typical Applications 1
EMI and FRI shielding, smooth, soft paste
Typical Applications 2
assembly and repair of circuit boards
Typical Applications 3
hand application, automatic dispensers
Typical Applications 4
screen-printing, transfer or stamping techniques
condition
New


Technical Product Bulletin

HEAT CURE SILVER FILLED ELECTRICALLY CONDUCTIVE EPOXY 

MAXIMUM CONTINUITY OF CONDUCTIVITY


THIS PRODUCT DOES NOT CURE/HARDEN UNLESS HIGH HEAT IS APPLIED.

We have some different products that do not require heating. 

PRODUCT DESCRIPTION:

AA-DUCT 904 is a single component, heat curing, conductive epoxy that was designed for ease in handling. This high performance conductive

epoxy cures quickly at elevated temperatures making it ideally suited for rapid processing and assembly.


AA-DUCT 904 offers excellent mechanical, electrical, and physical properties at continuous operating temperatures up to 175°C.  This versatile

silver conductive adhesive can be used for chip bonding in micro and opto-electronic hybrid circuit fabrication. 


AA-DUCT 904 has also been used in microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and electronic

component manufacturing.


AA-DUCT 904 is a smooth, soft paste that can be applied by hand application, automatic dispensers, screen-printing, transfer or stamping

techniques.  It is available in both a lower and higher viscosity grade for use in a variety of dispensing equipment and application techniques.

 

CURED PROPERTIES:

Hardness, Shore D

83

 

PRODUCT PROPERTIES:

Appearance

Silver

Cure Type

Heat cure

Benefits

·         High strength

·         Excellent mechanical, electrical properties

Substrates

·         Integrated Circuits

·         Aluminum

·         Copper

·         Magnesium

·         Steel

·         Bronze

·         Nickel

·         Ceramic

·         Glass

·         Phenolic

·         G-10 epoxy glass boards.


CURE SCHEDULE:

2 hours

@ 125°C

1 hour

@ 150°C

1/2 hours

@ 175°C

 

UNCURED PROPERTIES:

Viscosity @ 25 °C  cps

200,000

Shelf life

6 Months

Density

3.6

 

THERMAL PROPERTIES:

Thermal Conductivity, btu/hr/ft2/°F/in:

16.1

Coefficient of Thermal Expansion  

60x 10^-6 (in/in) C

Operating Temperature

-55°C to +175°C

Intermit. to 325


ELECTRICAL PROPERTIES:

Volume Resistivity ohm. cm

0.001


NASA OUTGASSING RESULTS:

TML (Total Mass Loss) % 0.38

TML (Total Mass Loss) % 0.38

CVCM (Collected Volatile Condensable Materials) % 0.01

CVCM (Collected Volatile Condensable Materials) % 0.01

WVR (Water Vapor Recovery) % 0.07

WVR (Water Vapor Recovery) % 0.07

 

GENERAL INFORMATION:

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).


HOW TO USE:

1) Carefully clean and dry all surfaces to be bonded.

2) Apply AA-DUCT 904 adhesive to the prepared surfaces.

3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.


AVAILABILITY:

This epoxy can be supplied in various different packages.